DS3820HSMD

DS3820HSMD is a Heat Sink Assembly Board developed by GE under Mark IV system. This board plays a critical role in heat dissipation and thermal management within the system, ensuring optimal performance and reliability of the components it supports.

Features

• Specifically designed as a Heat Sink Assembly Board, emphasizing its crucial role in dissipating heat generated by various components within the Mark IV system. Heat sinks are essential to maintain the temperature of sensitive electronic components within safe operating limits, preventing overheating and potential damage.
• Features three male terminal connectors that serve as the primary interface for connecting the board with surrounding boards or components. Each connector plays a specific role in data and power transmission between the card and other parts of the system.
• Ten metal pins spaced out in pairs. These pins likely serve as electrical connectors for data and power signals, enabling efficient communication between the board and compatible boards or modules. The pair spacing might follow specific data protocols or bus configurations to support reliable and high-speed data transfer.
• The smaller white terminal features six metal pins, which may serve as additional input or output connectors, providing more connectivity options for specific functionalities or control signals.
• Offers approximately twenty ports, making it a versatile and comprehensive interface for connecting with other components or systems. These ports likely support various data, control, and power connections, enabling seamless integration and efficient operation.
• Optimized for effective heat dissipation. Its design and materials facilitate the rapid transfer of heat away from critical components, ensuring stable performance and preventing thermal-related issues that could lead to system malfunctions or failures.
• Proper thermal management is crucial in maintaining the overall health and longevity of the Mark IV system. The board's reliable thermal management capabilities ensure that sensitive components operate within their specified temperature ranges, reducing the risk of premature wear and extending the system's operational life.
• The male terminal connectors facilitate optimized board interconnectivity. By establishing secure and efficient connections with surrounding boards or modules, the component enhances the overall performance and coordination of the Mark IV system.